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热传导型半导体器件的二次元特征有限体积元方法及分析:H1模估计

陈传军;袁益让   

  1. 烟台大学数学与信息科学系 烟台 264005;

    山东大学数学与系统科学学院 济南 250100;

  • 收稿日期:2006-02-16 修回日期:2007-09-22 出版日期:2008-06-25 发布日期:2008-06-25
  • 通讯作者: 陈传军
  • 基金资助:
    国家重点基础研究专项经费(G1999032803)、 国家自然科学基金(10372052, 10271066)和教育部

Quadratic Finite Volume Element Method Along Characteristics

for the Semiconductor Device of Heat Conduction:

H1Error Estimates

Chen Chuanjun; Yuan Yirang   

  1. Department of Mathematics, Yantai University, Yantai 264005;

    School of Mathematics and System Sciences, Shandong University, Jinan 250100;

  • Received:2006-02-16 Revised:2007-09-22 Online:2008-06-25 Published:2008-06-25
  • Contact: Chen Chuanjun

摘要: 该文构造了热传导型半导体器件的全离散特征有限体积元格式,将特征线方法与有限体积元方法相结合, 采用Lagrange型分片二次多项式空间和分片常数函数空间分别作为试探函数和检验函数空间,并进行误差分析,得到了最优阶H1模误差估计结果.

关键词: 半导体, 特征线方法, 有限体积元方法, 误差估计

Abstract: A fully discrete quadratic finite volume element method along characteristics for the semiconductor device of heat conduction is given, which is used by piecewise lagrange quadratic trial function and piecewise constant test function. Under general conditions, an optimal H1 error estimate is obtained.

Key words: Semiconductor, Method of characteristics, Finite volume methods, Error estimate

中图分类号: 

  • 65M